High Temperature Bakelite Nozzle - 3175A



GS Automation Technology Pte. Ltd. GS Automation (M) Sdn Bhd
We Are The Leading Semiconductor Packaging Equipment Supplier Company In Johor Bahru (JB), Malaysia, Specializing In Solid Crystal Machine, Tape Tester Machine, Etc.
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Description
Bakelite nozzle, tungsten steel nozzle, used to pick and place, operation, patch needs special design tools. Using USA DuPont materials, the ability of 480 temperature suitable for the conditions of normal temperature and high temperature. The development of the bakelite nozzle, tungsten steel nozzle variety suitable for ASM, KNS, KAIJI, SHINKAWA, ESEC and other equipment, the minimum bore can be used for bonding, 0.08mm, eutectic or soft solder chip such as semiconductor, LED etc.. Can be customized according to the needs of customers processing.Parameters
Part No | D | L (Length) | A | B |
Diameter | mm | |||
3175A-11MM-VES-CT-008-003 | 3.175 | 11 | 0.200 | 0.075 |
3175A-14MM-VES-CT-008-004 | 3.175 | 14 | 0.200 | 0.100 |
3175A-14MM-VES-CT-010-005 | 3.175 | 14 | 0.250 | 0.125 |
3175A-14MM-VES-CT-012-006 | 3.175 | 14 | 0.300 | 0.150 |
3175A-14MM-VES-CT-014-007 | 3.175 | 14 | 0.350 | 0.175 |
3175A-14MM-VES-CT-016-008 | 3.175 | 14 | 0.400 | 0.200 |
3175A-17MM-VES-CT-020-010 | 3.175 | 17 | 0.500 | 0.250 |
3175A-20MM-VES-CT-030-015 | 3.175 | 20 | 0.750 | 0.375 |
3175A-XXMM-VES-CT-XXX-XXX | 3.175 | XX | X.XXX | X.XXX |