HAN-3291 TRAY-BOX Die bonder
High speed: UPH 16K 220ms/cycle
Dedicate to die picking function from wafer to TRAY-box(bonding without epoxy)
Suitable for various products: such as SMD LED, display LED, lamp LED, smart card IC, COB, power LED etc.
High precision 1.5 mil3°
Product advantages:
1. Extra-large and flexible work table
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Extra-large material work table,5.5× 8double-groove(Maximum 5.5x16)
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Only 10 minutes changing time for different device
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Smart general jig design for diverse material requirement
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Automatic fixture locking setup
2. Twin vision systems for wafer and bonding for higher die bonding precision
3. Single monitors and operation modes for real time operation status monitor and easier operation
4. Advanced die picking system
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Pressure Sensing for die picking detection, prevent from missing die
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Breakage wafer protection to ensure production quality
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Programmable die searching area, die position and ejector settings
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Options of 4×6”wafer ring or 1×8”wafer ring
